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PACD process development

Report - W.H.A. Wien, S. Milosavljevic, L.K. Nanver, H. Schellevis, T.L.M. Scholtes, J.W.T. Heemskerk, C Ortiz, JHCM Slabbekoorn, A Poliakov, M. Bartek, JN Burghartz

Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

Conference paper - M Saadaoui, W.H.A. Wien, H.W. van Zeijl, A. van den Bogaard, Pasqualina M Sarro

Metal patterning on high topography surface for 3D RF devices fabrication

Conference paper - PN Pham, E Boellaard, W.H.A. Wien, LDM van den Brekel, JN Burghartz, Pasqualina M Sarro

Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

Conference paper - M Saadaoui, W.H.A. Wien, H.W. van Zeijl, H. Schellevis, M Laros, Pasqualina M Sarro

High-efficiency silicon photodiode detector for sub-keV electron microscopy

Journal article - A. Sakic, G van Veen, K Kooijman, P. Vogelsang, T.L.M. Scholtes, W.B. de Boer, J. Derakhshandeh Kheljani, W.H.A. Wien, S. Milosavljevic, L.K. Nanver

Metal patterning on high topography surface for 3D RF devices fabrication

Journal article - NP Pham, E Boellaard, W.H.A. Wien, LDM van den Brekel, JN Burghartz, Pasqualina M Sarro

Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

Journal article - M Saadaoui, H van Zeijl, Pasqualina M Sarro, W.H.A. Wien, HTM Pham, C. Kwakernaak, HCM Knoops, WMM Kessels, RMCM van de Sanden, FC Voogt, F Roozeboom

PVD aluminium nitride as heat-spreader in IC technology

Conference paper - L. La Spina, H. Schellevis, N Nenadovic, S. Milosavljevic, W.H.A. Wien, AW van Herwaarden, L.K. Nanver

Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin Films

Journal article - L. La Spina, AW van Herwaarden, H. Schellevis, W.H.A. Wien, N Nenadovi¿, L.K. Nanver

Through-wafer electrical vias for RF silicon technology

Conference paper - Z Wang, L Wang, H. Schellevis, W.H.A. Wien, JN Burghartz, Pasqualina M Sarro

MEMS test structure for measuring thermal conductivity of thin films

Conference paper - L. La Spina, N Nenadovic, AW van Herwaarden, H. Schellevis, W.H.A. Wien, L.K. Nanver

Patterned growth of carbon nanotubes for vertical interconnects in 3D integrated circuits

Conference paper - S. Vollebregt, R. Ishihara, W.H.A. Wien, J. van der Cingel, C.I.M. Beenakker

Microcantilevers inside nanoliter wells

Conference paper - W.J. Venstra, W.H.A. Wien, J.W. Spronck, Pasqualina M Sarro, J. van Eijk

Microcantilevers inside nanoliter wells

Conference paper - W.J. Venstra, W.H.A. Wien, J.W. Spronck, Pasqualina M Sarro, J. van Eijk

Integrated microcantilevers for mechanical detection of biomolecules

Conference paper - W.J. Venstra, J.W. Spronck, W.H.A. Wien, Pasqualina M Sarro, J. van Eijk, R.H. Munnig Schmidt

Thermal characterization of microliter amounts of liquids by a micromachined calorimetric transducer

Conference paper - G Parr, E. Iervolino, AW van Herwaarden, W.H.A. Wien, MJ Vellekoop

Versatile silicon photodiode detector technology for scanning electron microscopy with high-efficiency sub-5 keV electron detection

Conference paper - A. Sakic, L.K. Nanver, T Knezevic, I Spee, G van Veen, K Kooijman, P. Vogelsang, T.L.M. Scholtes, W.B. de Boer, W.B. de Boer, W.H.A. Wien, S. Milosavljevic, C.T.H. Heerkens

Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Conference paper - M Saadaoui, W.H.A. Wien, H.W. van Zeijl, H. Schellevis, M Laros, Pasqualina M Sarro

Two-Dimensional Fiber Positioning and Clamping Device for Product-Internal Microassembly

Journal article - VA Henneken, WP Sassen, M. Tichem, Pasqualina M Sarro, W.H.A. Wien, W. van der Vlist

Reduction of surface roughness of a silicon chip for advanced nanocalorimetry

Journal article - L. La Spina, D Ovchinnikov, W.H.A. Wien, AW van Herwaarden, E.J.G. Goudena, J Loos, L.K. Nanver

W.H.A. Wien

Authored

PACD process development

Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

Metal patterning on high topography surface for 3D RF devices fabrication

Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

High-efficiency silicon photodiode detector for sub-keV electron microscopy

Metal patterning on high topography surface for 3D RF devices fabrication

Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

PVD aluminium nitride as heat-spreader in IC technology

Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin Films

Through-wafer electrical vias for RF silicon technology

MEMS test structure for measuring thermal conductivity of thin films

Patterned growth of carbon nanotubes for vertical interconnects in 3D integrated circuits

Microcantilevers inside nanoliter wells

Microcantilevers inside nanoliter wells

Integrated microcantilevers for mechanical detection of biomolecules

Thermal characterization of microliter amounts of liquids by a micromachined calorimetric transducer

Versatile silicon photodiode detector technology for scanning electron microscopy with high-efficiency sub-5 keV electron detection

Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Two-Dimensional Fiber Positioning and Clamping Device for Product-Internal Microassembly

Reduction of surface roughness of a silicon chip for advanced nanocalorimetry