SOG fabrication of bulk micromachined and bonded capacitive inertial sensor structures (U_SP_2_I_IC_T)

DRIE assisted HAR MEMS processing of inertial sensors and actuators

Fabrication of a SOG-MEMS vibratory gyroscope by deep RIE technology and bonding (U_SP_2_I_IC_T)

Size-dependency of cryo-icp-etching-based process for the fabrication of biomimetic membrane-in-recess microstructure

Biomimetic strain-sensing microstructure for improved strain sensor: fabrication results and optical characterization

Design and preliminary fabrication of a new micromachined silicon strain sensor based on the campaniform sensillum of insects

Development of dry etch technology for intelligent micromachined devices

Design, and early stages-fabrication of new biomimetric strain-sensing microstructures

Fabrication and initial characterisation results of a micromachined biomimetic strain sensor inspired from the campaniform sensillum of insects

Fabrication results and qualitative optical characterisation of a new type biomimetric strain-sensing micro-structures

Single step IC-compatible processing of inertial sensors using SF6-O2 cryogenic plasma process

Processing of inertial sensors using SF6-O2 Cryogenic plasma process

Wafer thinning for high-density, through-wafer interconnects

Progress report may 2003

IC-compatible processing of inertial sensors using SF6-O2 cryogenic plasma process

Single step cryogenic SF6/O2 plasma etching process for the development of inertial devices

Copper film microgrid through-wafer metalization

Progress report may 2002

Through-wafer copper electroplating for RF silicon technology

Through-wafer copper electroplating for three-dimensional interconnects