Person | TU Delft Repository

SOG fabrication of bulk micromachined and bonded capacitive inertial sensor structures (U_SP_2_I_IC_T)

Conference paper - V. Rajaraman, G Craciun, H Yang, E.W.J.M. van der Drift, P.J. French

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma.

Conference paper - G Craciun, MA Blauw, E.W.J.M. van der Drift, Pasqualina M Sarro, P.J. French

Single step cryogenic SF6/O2 plasma etching process for the development of a novel quad gyroscope

Conference paper - G Craciun, H Yang, MA Blauw, E.W.J.M. van der Drift, P.J. French

DRIE assisted HAR MEMS processing of inertial sensors and actuators

Conference paper - V. Rajaraman, SL Paalvast, G Craciun, J.C. Wolff, K.A.A. Makinwa, P.J. French

Single step cryogenic SF6/O2 plasma etching process for the development of inertial devices

Conference paper - G Craciun, H Yang, H.W. van Zeijl, L.S. Pakula, MA Blauw, E.W.J.M. van der Drift, P.J. French

Limitations and complementary value of cryogenic SF6-O2 and Bosch plasma etch process for silicon micromachining.

Conference paper - MA Blauw, G Craciun, E.W.J.M. van der Drift, P.J. French

Fabrication of a SOG-MEMS vibratory gyroscope by deep RIE technology and bonding (U_SP_2_I_IC_T)

Book chapter - V. Rajaraman, G Craciun, H Yang, L.S. Pakula, E.W.J.M. van der Drift, K.A.A. Makinwa, P.J. French

Copper film microgrid through-wafer metalization

Conference paper - VG Kutchoukov, G Craciun, S Sakarya, J.R. Mollinger, A. Bossche

Progress report may 2002

Report - G Craciun, E.W.J.M. van der Drift, P.J. French

Aspect ratio and crystallographic orientation dependence in deep dry silicon etching at cryogenic temperatures.

Conference paper - G Craciun, MA Blauw, E.W.J.M. van der Drift, P.J. French

Design, and early stages-fabrication of new biomimetric strain-sensing microstructures

Conference paper - DHB Wicaksono, G. Pandraud, G Craciun, JFV Vincent, P.J. French

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Journal article - G Craciun, MA Blauw, E.W.J.M. van der Drift, Pasqualina M Sarro, P.J. French

Progress report may 2003

Report - G Craciun, E.W.J.M. van der Drift, P.J. French

Thinning of micromachined wafers for high-density, through-wafer interconnects

Conference paper - L Wang, C.C.G. Visser, C.R. de Boer, M Laros, W. van der Vlist, J. Groeneweg, G Craciun, Pasqualina M Sarro

Through-wafer copper electroplating for three-dimensional interconnects

Journal article - NT Nguyen, E Boellaard, NP Pham, VG Kutchoukov, G Craciun, Pasqualina M Sarro

Through-wafer copper electroplating for three-dimensional interconnects

Journal article - NT Nguyen, E Boellaard, NP Pham, VG Kutchoukov, G Craciun, Pasqualina M Sarro

Through-wafer copper electroplating for RF silicon technology

Conference paper - NT Nguyen, TK Ng, E Boellaard, NP Pham, G Craciun, Pasqualina M Sarro, JN Burghartz

Fabrication and initial characterisation results of a micromachined biomimetic strain sensor inspired from the campaniform sensillum of insects

Conference paper - DHB Wicaksono, G. Pandraud, G Craciun, JFV Vincent, P.J. French

Wafer thinning for high-density, through-wafer interconnects

Conference paper - L Wang, C.C.G. Visser, C.R. de Boer, J.M.W. Laros, W. van der Vlist, J. Groeneweg, G Craciun, Pasqualina M Sarro

Single step IC-compatible processing of inertial sensors using SF6-O2 cryogenic plasma process

Conference paper - G Craciun, H Yang, L.S. Pakula, E.W.J.M. van der Drift, P.J. French

G Craciun

Authored

SOG fabrication of bulk micromachined and bonded capacitive inertial sensor structures (U_SP_2_I_IC_T)

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma.

Single step cryogenic SF6/O2 plasma etching process for the development of a novel quad gyroscope

DRIE assisted HAR MEMS processing of inertial sensors and actuators

Single step cryogenic SF6/O2 plasma etching process for the development of inertial devices

Limitations and complementary value of cryogenic SF6-O2 and Bosch plasma etch process for silicon micromachining.

Fabrication of a SOG-MEMS vibratory gyroscope by deep RIE technology and bonding (U_SP_2_I_IC_T)

Copper film microgrid through-wafer metalization

Progress report may 2002

Aspect ratio and crystallographic orientation dependence in deep dry silicon etching at cryogenic temperatures.

Design, and early stages-fabrication of new biomimetric strain-sensing microstructures

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Progress report may 2003

Thinning of micromachined wafers for high-density, through-wafer interconnects

Through-wafer copper electroplating for three-dimensional interconnects

Through-wafer copper electroplating for three-dimensional interconnects

Through-wafer copper electroplating for RF silicon technology

Fabrication and initial characterisation results of a micromachined biomimetic strain sensor inspired from the campaniform sensillum of insects

Wafer thinning for high-density, through-wafer interconnects

Single step IC-compatible processing of inertial sensors using SF6-O2 cryogenic plasma process