RE
RAB Engelen
Authored
7 records found
In this paper, the interaction between chip and package is investigated with the focus on low ppm-level failures. More specifically, the failure mode of inter-metal shorts is investigated, caused by either electrical discharges (ESD) or internal/external mechanical forces. It is
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The first part of this paper deals with the analysis of layer buckling and delamination of thin film multilayer structures that are used in flexible display applications. To this end, 250 nm thick indium tin oxide (ITO) layers have been deposited on a 200 µm thick high temperatur
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The mechanical response at the interface between the silicon, low-k and copper layer of the wafer is simulated herein under the loading of the chemical-mechanical polishing (CMP). To identify the possible generation/propagation of the initial crack, the warpage induced by the thi
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For integrated circuit (IC) wafer back-end development, state-of-the-art CMOS-technologies have to be developed and robust bond pad structures have to be designed in order to guarantee both functionality and reliability during waferfab processes, packaging, qualification tests, a
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The first part of this paper deals with the analysis of layer buckling and delamination of thin film multi-layer structures that are used in flexible display applications. To this end, 250 nm thick indium tin oxide (ITO) layers have been deposited on a 200 µm thick high temperatu
...