GZ

G.Q. Zhang

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Authored

16 records found

Virtual thermo-mechanical prototyping of microelectronics: the challenges for mechanics professionals
Conference paper - G.Q. Zhang, P Maessen, L.J. Ernst, ? et al

Packaging induced die stresses considering time-dependent behaviour of a molding compound

Finite element modeling of solder interconnection reliability with variable solder geometry
Conference paper - XJ Zhao, G.Q. Zhang, JFJ Caers, L.J. Ernst

Response surface modeling for non-linear packaging stresses

Packaging polymer's curing process characterisation and modelling

Time and temperature dependent thermo-mechanical characterization and modeling of a packaging molding compound
Conference paper - MS Kiasat, L.J. Ernst, G.Q. Zhang, ? et al

Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties
Conference paper - DG Yang, G.Q. Zhang, L.J. Ernst, ? et al

Innovative thermo-mechanical design and qualification of microelectronics - the challenges for mechanical professionals
Conference paper - G.Q. Zhang, P Maessen, J Bisschop, L.J. Ernst

31-34 HGz low noise amplifier with on-chip microstrip lines and inter-stage matching in 90 nm baseline CMOS

Semi-analytical stability analysis of doubly-curved orthotropic shallow panels - considering the effects of boundary conditions

Buckling driven interface delamination between a thin metal layer and a ceramic substrate

Creep behavior of a molding compound and its effect on packaging process stresses
Conference paper - MS Kiasat, G.Q. Zhang, L.J. Ernst, G. Wisse

Virtual thermo-mechanical prototyping of electronic packaging - challenges in material characterization and modeling
Conference paper - G.Q. Zhang, AAO Tay, L.J. Ernst, ? et al

Virtual thermo-mechanical prototyping of electronic packaging - the bottlenecks and solutions for damage modeling
Conference paper - G.Q. Zhang, AAO Tay, L.J. Ernst

Virtual thremo-mechanical prototyping of electronic packaging using Philips optimization strategy
Conference paper - J. Janssen, G.Q. Zhang, L.J. Ernst, ? et al

Thermally induced delamination-buckling in a copper-ceramic microelectronic product
Conference paper - CJ Liu, G.Q. Zhang, L.J. Ernst, G. Wisse