Packaging induced die stresses considering time-dependent behaviour of a molding compound

Time dependent behavior of molding compound in packaging

On the constitutive modeling of thermosetting polymers for assembly process simulations

Creep behavior of a molding compound and its effect on packaging process stresses

Time and temperature dependent thermo-mechanical characterization and modeling of a packaging molding compound

damage modelling in cross-ply composite laminates with double-edge-semicircular notches

Vertical die crack stresses of Flip Chip induced in major package assembly processes

Modelling the cure-dependent viscoelastic behaviour of a thermosetting resin and residual curing stresses

Curing shrinkage and residual stresses in viscoelastic thermosetting resins and composites

Mechanical characterisation and simulation of packaging polymer curing

Thermo-mechanical characterization of packaging polymers during the curing process

The effect of the addition of a low profile additive on the curing shrinkage of an unsaturated polyester resin

Thermo-mechanical characterization of packaging polymers during the curing process (niet eerder opgenomen)

Packaging polymer's curing process characterisation and modelling