Packaging induced die stresses considering time-dependent behaviour of a molding compound

On the constitutive modeling of thermosetting polymers for assembly process simulations

Time and temperature dependent thermo-mechanical characterization and modeling of a packaging molding compound

Creep behavior of a molding compound and its effect on packaging process stresses

Time dependent behavior of molding compound in packaging

damage modelling in cross-ply composite laminates with double-edge-semicircular notches

Curing shrinkage and residual stresses in viscoelastic thermosetting resins and composites

Modelling the cure-dependent viscoelastic behaviour of a thermosetting resin and residual curing stresses

Mechanical characterisation and simulation of packaging polymer curing

Vertical die crack stresses of Flip Chip induced in major package assembly processes

Packaging polymer's curing process characterisation and modelling

Thermo-mechanical characterization of packaging polymers during the curing process

The effect of the addition of a low profile additive on the curing shrinkage of an unsaturated polyester resin

Thermo-mechanical characterization of packaging polymers during the curing process (niet eerder opgenomen)