Finite thickness influence on spherical and conical indentation on viscoelastic thin polymer film

Prediction of thermo-mechanical integrity of wafer backend processes

Finite thickness influence on spherical and conical indentation on viscoelastic thin polymer film

Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time- and temperature-effects

Prediction of thermo-mechanical integrity of wafer backend processes

Influence of visco-elasticity of low-k dielectrics on thermo-mechanical behavior of dual damascene process