8 records found
1
Measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound
Viscoelastic characterization of fast curing moulding compounds
Driving mechanisms of delamination related reliability problems inexposed pad packages
Analysis of Cu/low-k bond pad delamination by using a novel failure index
Warpage minimization of the HVQFN map mould
Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques
Virtual qualification of moisture induced failures of advanced packages
On wire failures in micro-electronic packages