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Journal article (3)

3 records found

1

Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

Journal article (2004) - C Videlot (author) , J Ackermann (author) , F Fages (author) , NT Nguyen (author) , L Wang (author) , Pasqualina M Sarro (author) , D Crawly (author) , K Nikolic (author) , M Forshaw (author)

3D molecular interconnection technology

Journal article (2003) - D Crawley (author) , K Nikolic (author) , M Forshaw (author) , J Ackermann (author) , C Videlot (author) , NT Nguyen (author) , L Wang (author) , Lina P.M. Sarro (author)

Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnecting applications

Journal article (2003) - J Ackermann (author) , C Videlot (author) , NT Nguyen (author) , L Wang (author) , Lina P.M. Sarro (author) , D Crawley (author) , K Nikolic (author) , M Forshaw (author)