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16 records found

Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be ...
Delamination between copper and epoxy molding compound (EMC) is one of the common failure modes in packages due to relatively weak adhesion at the interface. Delamination is difficult to predict because a package is often with a complex structure design constructed with different ...
Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of the ...
The present study deals with experimental investigation of the delamination toughness of EMC (epoxy molding compound) and Copper-leadframe interfaces. Test samples were directly obtained from the production line. EMC is attached on copper substrates with various surface treatment ...
Microelectronic packages can be considered as composite structures fabricated from highly dissimilar materials. Interface delamination related failure often occurs when the packaged devices are subjected to thermo-mechanical loading. The analysis of delamination of a laminate str ...
As we face higher numbers of material layers in the increasingly complex Microsystems, the rating of layers reliability has to keep pace. Fracture mechanical descriptions are a big qualitative improvement when using simulation for design and reliability support, especially when l ...
The rapid diversification in microelectronics forebodes more complex system integration, be it for denser function integration or a span of dimensions between various technologies. Products may include more features, perform faster and be cheaper. With these trends the amount of ...
Interfacial delamination has become one of the key reliability issues in the microelectronics of portable devices and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characteriza ...
Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) a ...
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage.@en
Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of inte ...