Micro-pin-fin evaporators are a promising alternative to multi-microchannel heat sinks for two-phase cooling of high power-density devices. Within pin-fin evaporators, the refrigerant flows through arrays of obstacles in cross-flow and is not restricted by the walls of a channel. The dynamics of bubbles generated upon flow boiling and the associated heat transfer mechanisms are expected to be substantially different from those pertinent to microchannels; however, the fundamental aspects of two-phase flows evolving through micro-pin-fin arrays are still little understood. This article presents a systematic analysis of flow boiling within a micro-pin-fin evaporator, encompassing bubble, thin-film dynamics and heat transfer. The flow is studied by means of numerical simulations, performed using a customised boiling solver in OpenFOAM v2106, which adopts the built-in geometric Volume of Fluid method to capture the liquid–vapour interface dynamics. The numerical model of the evaporator includes in-line arrays of pin-fins of diameter of 50μm and height of 100μm, streamwise pitch of 91.7μm and cross-stream pitch of 150μm. The fluid utilised is refrigerant R236fa at a saturation temperature of 30 °C. The range of operating conditions simulated includes values of mass flux G=500–2000kg/(m²s), heat flux q=200kW/m², and inlet subcooling ΔT_sub=0–5K. This study shows that bubbles nucleated in a pin-fin evaporator tend to travel along the channels formed in between the pin-fin lines. Bubbles grow due to liquid evaporation and elongate in the direction of the flow, leaving thin liquid films that partially cover the pin-fins surface. The main contributions to heat transfer arise from the evaporation of this thin liquid film and from a cross-stream convective motion induced by the bubbles in the gap between the cylinders, which displace the hot fluid otherwise stagnant in the cylinders wakes. When the mass flow rate is increased, bubbles depart earlier from the nucleation sites and grow more slowly, which results in a reduction of the two-phase heat transfer. Higher inlet subcooling yields lower two-phase heat transfer coefficients because condensation becomes important when bubbles depart from the hot pin-fin surfaces and reach highly subcooled regions, thus reducing the two-phase heat transfer.