Optical coherence tomography (OCT) systems have huge potential for applications beyond the traditional ophthalmology as a general-purpose medical instrument for optical biopsy. The widening of the range of applications is expected to significantly increase production volume and, consequently, puts pressure on unit cost. This trend calls for a flexible and miniaturized system fabricated in a batch process. In this paper, the different OCT configurations are compared for suitability in such an implementation. The required flexibility favors operation in the spectral domain, using a broadband light source in combination with a spectrometer, while the miniaturization and low unit-cost in batch fabrication can be achieved using silicon micro-system technologies. The feasibility of miniaturizing OCT components has already been demonstrated, amongst others a beam splitter using 45° saw dicing of a glass substrate and appropriate thin-film coating the integration of the essential components into a single OCT microsystem remains a challenge. In this paper, the wafer-level fabrication of a Michelson interferometer for a miniaturized OCT system is presented, using an improved 45° saw dicing process, which is suitable for wafer-level co-integration of also the other components of the OCT microsystem.