Chen, Haixue (author), Wang, Xinyue (author), Zeng, Zejun (author), Zhang, Kouchi (author), Zhang, Jing (author), Liu, Pan (author) With the development of electronic technology towards high power, miniaturization, and system integration, power electronic packaging is facing increasing challenges, especially for die attachment. This research aims to explore silver-coated copper (Cu@Ag) paste with sufficient mechanical properties and high-temperature reliability, as an...
journal article 2023