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document
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Lv, Guoping (author), Yan, Haidong (author), Yan, Haidong (author), Yang, Daoguo (author), Wu, Xinke (author), Sheng, Kuang (author), Liu, Chaohui (author), Zhang, Yakun (author), Zhang, Kouchi (author)
As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging...
conference paper 2022
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