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Wei, J. (author), Ye, H. (author), Van Zeijl, H.W. (author), Sarro, P.M. (author), Zhang, G.Q. (author)
A micro-electro-mechanical-system (MEMS) based, temperature triggered, switch is developed as a cost-effective solution for smart cooling control of solid-state-lighting systems. The switch (1.0x0.4 mm2) is embedded in a silicon substrate and fabricated with a single-mask 3D micro-machining process. The device switches on at a designed...
journal article 2012
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Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Maury, P. (author), Sarro, P.M. (author)
Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and...
journal article 2010
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Van Zeijl, H.W. (author), Wei, J. (author), Shen, C. (author), Verhaar, T.M. (author), Sarro, P.M. (author)
Lithography as developed for IC device fabrication is a high volume high accuracy patterning technology with strong 2 dimensional (2D) characteristics. This 2D nature makes it a challenge to integrate this technology in a 3 dimensional (3D) manufacturing environment. This article addresses the performance of a waferstepper (ASML PAS5000) in...
journal article 2010
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Van Zeijl, H.W. (author), Sarro, P.M. (author) journal article 2010
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Paalvast, S.L. (author), Van Zeijl, H.W. (author), Su, J. (author), Sarro, P.M. (author), Van Eijk, J. (author) journal article 2007
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