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document
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Zhang, B. (author), Damian, A.A. (author), Zijl, Jurrian (author), van Zeijl, H.W. (author), Zhang, Y. (author), Fan, J. (author), Zhang, Kouchi (author)
There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for die attach in high-power electronics. The performance of this technology is superior to that of the technology involving the use of lead-free solders. Although Cu NP paste is potentially a low-cost material, it faces the challenge of oxidation...
journal article 2021
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