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document
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Tang, H. (author), Ye, Huai-Yu (author), Chen, Xian-Ping (author), Qian, Cheng (author), Fan, Xue-Jun (author), Zhang, Kouchi (author)
In this paper, the heat transfer performance of the multi-chip (MC) LED module is investigated numerically by using a general analytical solution. The configuration of the module is optimized with genetic algorithm (GA) combined with a response surface methodology. The space between chips, the thickness of the metal core printed circuit board...
journal article 2017
Source URL (retrieved on 2024-06-08 13:07): https://repository.tudelft.nl/islandora/search/collection%3Air?collection=research&f%5B0%5D=mods_subject_topic_ss%3A%22OA%5C-Fund%5C%20TU%5C%20Delft%22&f%5B1%5D=mods_name_personal_author_namePart_family_ss%3A%22Ye%22&f%5B2%5D=mods_subject_topic_ss%3A%22thermal%5C%20resistance%22