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document
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Nanver, L.K. (author), Schellevis, H. (author), Scholtes, T.L.M. (author), La Spina, L. (author), Lorito, G. (author), Sarubbi, F. (author), Gonda, V. (author), Popadic, M. (author), Buisman, K. (author), De Vreede, L.C.N. (author)
This paper reviews special RF/microwave silicon device implementations in a process that allows two-sided contacting of the devices: the back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology (STT) developed at DIMES. In this technology, metal transmission lines can be placed on the low-loss glass substrate, while the...
journal article 2009
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