RF-MEMS wafer-level packaging using through-wafer interconnect
Journal Article
(2007)
Author(s)
J. Tian (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
S Sosin (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
J Iannacci (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
R Gaddi (External organisation)
M. Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
DOI related publication
https://doi.org/10.1016/j.sna.2007.09.004
To reference this document use:
https://resolver.tudelft.nl/uuid:015a1a85-412d-44a2-ab7a-f2533c36d53d
More Info
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Publication Year
2007
Research Group
Old - EWI Ch. Integrated Sensing Devices
Issue number
1
Volume number
142
Pages (from-to)
442-451
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