RF-MEMS wafer-level packaging using through-wafer interconnect

Tian, J.; Sosin, S; Iannacci, J; Gaddi, R; Bartek, M.

RF-MEMS wafer-level packaging using through-wafer interconnect

Journal article (2007)

Authors

J. Tian Old - EWI Ch. Integrated Sensing Devices

S Sosin Old - EWI Ch. Integrated Sensing Devices

J Iannacci Old - EWI Ch. Integrated Sensing Devices

R Gaddi External organisation

M. Bartek Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

To reference this document use:

http://resolver.tudelft.nl/uuid:015a1a85-412d-44a2-ab7a-f2533c36d53d

More Info

expand_more

Published Date

2007

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Old - EWI Ch. Integrated Sensing Devices

No files available

Metadata only record. There are no files for this journal article.