QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment

Conference paper (2005)

Authors

P Deixler External organisation
T Letavic External organisation
H Sun External organisation
N Bell External organisation
D Bower External organisation
A Yao External organisation
R van Langevelde External organisation
T Vanhoucke External organisation
WD van Noort External organisation
GAM Hurkx External organisation
D Crespo External organisation
C Biard External organisation
T Mahatdejkul External organisation
S Bardy External organisation
JW Slotboom Electronic Components, Technology and Materials - EEMCS
Y Bouttement External organisation
R Brock External organisation
PC Tan External organisation
V Saikumar External organisation
A Rodriguez External organisation
R Colclaser External organisation
P Keliowan External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2005

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials