Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder

Journal article (2021)

Authors

S. Zhuang Harbin University of Science and Technology, Yangzhou University
Yang Liu Yangzhou University
H. Zhang Electronic Components, Technology and Materials - EEMCS
Min Zhou Yangzhou University
Yuxiong Xue Yangzhou University
Xianghua Zeng Yangzhou University
Rongxing Cao Yangzhou University
Penghui Chen Yangzhou University
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Microstructure Hardness SnBi Shear behaviour Interfacial layers
More Info
expand_more

Published Date

2021

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Sn-Ag-x solders were used as the interfacial layers between SnBi solder and Cu substrate. The effects of Sn-Ag-x layers on the solderability, microstructure, and mechanical properties of SnBi solder joint were investigated. Experimental results indicate that all the barrier layers have positive effects on improving the wettability of SnBi solder. The relative area and grain size of β-Sn was enlarged due to the addition of Sn-Ag-x layers. Meanwhile, the addition of the interfacial layers decreased the hardness of the SnBi solder joint. The addition of Sn-Ag-x layers increased the thickness of the interfacial intermetallic compound (IMC) but had limited effects on the shear force of the SnBi solder joint. Due to the addition of the interfacial layers, the brittleness of the SnBi/Cu solder joints during the shear test was slightly suppressed.