Analysis of Thermal Contact Conductance: Experimental Campaign combined with Surfaces Topology study and Contact Modelling

Abstract

Prediction of heat transfer phenomena and resulting temperature distributions is crucial among many appliances in the industry sector. In a vacuum, the dominant mode of heat transfer is conduction. The resulting temperature drop at the body’s interface is dependent on a parameter known as Thermal Contact Conductance (TCC) or, alternatively, Thermal Contact Resistance (TCR). During the literature study, it was found that several parameters are mainly affecting the heat transfer performance between the samples: surface roughness, contact pressure, material properties, and environmental conditions. The Thesis project is accomplished in cooperation with Philips Engineering Solutions (PES). For the Thesis, it is proposed to explore the TCC phenomenon through a combined study. The first part is investigating newly manufactured samples with a modified experimental setup in vacuum conditions. Before the Main Test Campaign started, the experimental setup and old laboratory samples were tested to mark the way. Also, several more samples were tested alongside the Main Tests to extend the TCC database. Another important study goal is to perform thorough surface analysis using a Digital Microscope. The analysis results in a surface roughness evolution study and reconstruction of the surfaces using MATLAB © software. The surfaces are then matched together to simulate and predict the parameter known as the real contact area. The study ends with a section summarizing the investigation and proposing recommendations and possible further research.