Hybrid wafer level packaging for RF MEMS applications

Iannacci, J; Bartek, M; Tian, J.; Sosin, S; Akhnoukh, Atef; Gaddi, R; Gnudi, A

Hybrid wafer level packaging for RF MEMS applications

Conference paper (2006)

Authors

J Iannacci Old - EWI Ch. Integrated Sensing Devices

M Bartek Old - EWI Ch. Integrated Sensing Devices

J. Tian Old - EWI Ch. Integrated Sensing Devices

S Sosin Old - EWI Ch. Integrated Sensing Devices

Atef Akhnoukh Old - EWI Ch. Integrated Sensing Devices

R Gaddi External organisation

A Gnudi External organisation

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2006

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Research Group

Old - EWI Ch. Integrated Sensing Devices

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