Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane
W. J. Westerveld (TU Delft - QID/Hanson Lab, IMEC-Solliance)
S. M. Leinders (ImPhys/Acoustical Wavefield Imaging )
P. L.M.J. Van Neer (ImPhys/Acoustical Wavefield Imaging , TNO)
H. P. Urbach (TU Delft - ImPhys/Optics)
N. De Jong (ImPhys/Acoustical Wavefield Imaging )
M. D. Verweij (ImPhys/Acoustical Wavefield Imaging )
X. Rottenberg (IMEC-Solliance)
V. Rochus (IMEC-Solliance)
More Info
expand_more
Abstract
Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic ring resonator embedded in a silicon-dioxide acoustical membrane. This work presents new OMUS modelling: acousto-mechanical non-linear FEM and photonic circuit equations. We show that initial wafer stress needs to be considered in the design: the acoustical resonance frequency changes considerably and OMUS sensitivity differs for up-or downwards buckled membranes. Simulated acoustical resonance frequency agrees well with measurements, assuming realistic SOI wafer stress. Measured sensitivity showed large device-to-device variation and simulations agree within this order of magnitude. We conclude that careful modeling of stress is necessary (b) for the design of robust and sensitive sensors.