Terahertz antennas with silicon micromachined front-end

Conference Paper (2014)
Author(s)

Goutam Chattopadhyay (California Institute of Technology)

Theodore Reck (California Institute of Technology)

Cecile Jung-Kubiak (California Institute of Technology)

Choonsup Lee (California Institute of Technology)

Jose Siles (California Institute of Technology)

Naser Chahat (California Institute of Technology)

Ken Cooper (California Institute of Technology)

Erich Schlecht (California Institute of Technology)

Maria Alonso-Delpino (Universitat Politecnica de Catalunya)

Imran Mehdi (California Institute of Technology)

Affiliation
External organisation
DOI related publication
https://doi.org/10.1109/EuCAP.2014.6902367 Final published version
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Publication Year
2014
Language
English
Affiliation
External organisation
Article number
6902367
Pages (from-to)
2647-2649
ISBN (electronic)
9788890701849
Event
8th European Conference on Antennas and Propagation, EuCAP 2014 (2014-04-06 - 2014-04-11), The Hague, Netherlands
Downloads counter
320

Abstract

Increasingly, terahertz systems are being used for multi-pixel receivers for different applications from mapping the star-forming regions of galaxies to stand-off radar imaging. Since microstrip patch antennas are too lossy and corrugated horn antenna arrays are difficult to machine at terahertz frequencies, suitable antenna array designs have been one of the key area of research for this field. Moreover, silicon micromachined waveguide housing for front-end integration is becoming very popular for multi-pixel terahertz instruments. This paper describes multi-pixel terahertz instruments with silicon-micromachined front-end and discusses design challenges for integrating terahertz antennas with such systems.