High temperature, high power density packaging for automotive applications

Conference paper (2003)

Authors

M.B. Gerber Electrical Power Processing
Jan Abraham Ferreira Electrical Power Processing
IW Hofsajer External organisation
N Seliger External organisation
Research Group
Electrical Power Processing
More Info
expand_more

Published Date

2003

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Electrical Power Processing