High temperature, high power density packaging for automotive applications
Conference Paper
(2003)
Author(s)
MB Gerber (TU Delft - Electrical Power Processing)
JA Ferreira (TU Delft - Electrical Power Processing)
IW Hofsajer (External organisation)
N Seliger (External organisation)
Research Group
Electrical Power Processing
To reference this document use:
https://resolver.tudelft.nl/uuid:3e94943f-cda4-4f04-8ab9-4765d0fcfb2c
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Publication Year
2003
Research Group
Electrical Power Processing
Pages (from-to)
1-8
ISBN (print)
0-7803-7755-9
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