A back-wafer contacted silicon-on-glass integrated bipolar process - Part II: a novel analysis of thermal breakdown

Journal article (2004)

Authors

N Nenadovic Electronic Components, Technology and Materials - EEMCS
V d' Alessandro External organisation
L.K. Nanver Electronic Components, Technology and Materials - EEMCS
F Tamigi External organisation
N Rinaldi External organisation
JW Slotboom Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2004

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials