A back-wafer contacted silicon-on-glass integrated bipolar process - Part II: a novel analysis of thermal breakdown

Nenadovic, N; d' Alessandro, V; Nanver, L.K.; Tamigi, F; Rinaldi, N; Slotboom, JW

A back-wafer contacted silicon-on-glass integrated bipolar process - Part II: a novel analysis of thermal breakdown

Journal article (2004)

Authors

N Nenadovic Electronic Components, Technology and Materials -

V d' Alessandro External organisation

L.K. Nanver Electronic Components, Technology and Materials -

F Tamigi External organisation

N Rinaldi External organisation

JW Slotboom Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2004

Language

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials