A back-wafer contacted silicon-on-glass integrated bipolar process - Part II: a novel analysis of thermal breakdown
Journal Article
(2004)
Author(s)
N Nenadovic (TU Delft - Electronic Components, Technology and Materials)
V d' Alessandro (External organisation)
L.K. Nanver (TU Delft - Electronic Components, Technology and Materials)
F Tamigi (External organisation)
N Rinaldi (External organisation)
JW Slotboom (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:3f50be1a-2805-4c52-accd-43109e8bad6f
More Info
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Publication Year
2004
Research Group
Electronic Components, Technology and Materials
Issue number
1
Volume number
51
Pages (from-to)
51-62
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