Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions

Abstract

In microelectronic packages, generally the chip is encapsulated by a molding compound (MC). The MC provides a mechanical support for the chip and isolates it from the environment and as a result protects the encapsulated chip. It is well known that MC's are polymer-based materials. When packages are exposed to a harsh environment such as to high-temperature storage or to thermal cycling, the mechanical properties of the MC's can change significantly. Consequently this could result into reliability issues of these packages. For a long time, there was no simple and efficient model method available to simulate the mechanical behavior of these packages under thermal aging conditions. As a result, it was hard to forecast the package reliability after a period of thermal aging. Since in our previous work [1,2] the thermomechanical properties of MC's before and after thermal aging were systematically characterized, the above problem was merely solved. A simple and efficient modeling method was proposed to simulate the thermal aging effects on MC's [2]. In this paper, a bi-material sample consisting of a MC layer on a Copper substrate is prepared and used to verify the proposed modeling method at two different thermal conditions: High-temperature storage (HTS) and Temperature cycling (TC). Based on the proposed modeling method the mechanical behavior of the bi-material sample after aging under these (different) thermal conditions are established throug FEM simulation. The simulation results match the experiment results quite well.