Super Tough and Spontaneous Water-Assisted Autonomous Self-Healing Elastomer for Underwater Wearable Electronics
Cyuan Lun He (National Taipei University of Technology)
Fang Cheng Liang (National Taipei University of Technology)
Loganathan Veeramuthu (National Taipei University of Technology)
Chia Jung Cho (National Taipei University of Technology)
Jean Sebastien Benas (National Taipei University of Technology)
Yung Ru Tzeng (National Taipei University of Technology)
Yen Lin Tseng (National Taipei University of Technology)
Wei Cheng Chen (National Taipei University of Technology)
Alina Rwei (TU Delft - ChemE/Product and Process Engineering)
Chi Ching Kuo (National Taipei University of Technology)
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Abstract
Self-healing soft electronic material composition is crucial to sustain the device long-term durability. The fabrication of self-healing soft electronics exposed to high moisture environment is a significant challenge that has yet to be fully achieved. This paper presents the novel concept of a water-assisted room-temperature autonomous self-healing mechanism based on synergistically dynamic covalent Schiff-based imine bonds with hydrogen bonds. The supramolecular water-assisted self-healing polymer (WASHP) films possess rapid self-healing kinetic behavior and high stretchability due to a reversible dissociation–association process. In comparison with the pristine room-temperature self-healing polymer, the WASHP demonstrates favorable mechanical performance at room temperature and a short self-healing time of 1 h; furthermore, it achieves a tensile strain of 9050%, self-healing efficiency of 95%, and toughness of 144.2 MJ m−3. As a proof of concept, a versatile WASHP-based light-emitting touch-responsive device (WASHP-LETD) and perovskite quantum dot (PeQD)-based white LED backlight are designed. The WASHP-LETD has favorable mechanical deformation performance under pressure, bending, and strain, whereas the WASHP-PeQDs exhibit outstanding long-term stability even over a period exceeding one year in a boiling water environment. This paper provides a mechanically robust approach for producing eco-friendly, economical, and waterproof e-skin device components.
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