Interconnect and packaging technologies for terahertz communication systems

Conference paper (2017)

Authors

G. Chattopadhyay California Institute of Technology
Theodore James Reck California Institute of Technology
Cecile Jung-Kubiak California Institute of Technology
M. Alonso Del Pino California Institute of Technology
Choonsup Lee California Institute of Technology
Affiliation
External organisation
Terahertz Packaging DRIE Interconnects Micromachining
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Published Date

15-05-2017

Language

English

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Affiliation

External organisation

Abstract

Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.