Local Corrosion of Electronic Materials
Corrosion Mechanisms and Optimisation Strategies for ENIG Coatings on Copper Substrates
M. Mousavi (TU Delft - Mechanical Engineering)
J.M.C. Mol – Promotor (TU Delft - Mechanical Engineering)
Y. Gonzalez Garcia – Promotor (TU Delft - Mechanical Engineering)
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Abstract
The rapid advancement in electronics, driven by intricate circuit design and manufacturing miniaturisation, has enabled the development of compact devices used in a wide range of applications. To ensure the performance and reliability of these sophisticated devices, it is crucial to study corrosion behaviour and performance at micro- and nanoscale levels. Traditional methods often fall short in addressing these challenges, highlighting the need for advanced localised techniques to understand corrosion mechanisms and develop strategies that ensure the durability of these critical devices in harsh conditions. This thesis investigates the localised aqueous corrosion study of Electroless Nickel Immersion Gold (ENIG) final finishing on copper substrates, which are widely used in printed circuit boards (PCBs) for electronic applications. Through a series of experimental studies, the research explores how micro-defects, phosphorus content, and bath parameters influence the corrosion resistance of ENIG and electroless nickel-phosphorus (NiP) coatings. Utilising advanced electrochemical and surface analysis techniques, the findings provide valuable insights into optimising coating processes to enhance the reliability and longevity of electronic components in harsh environments...