The application of RSM in optimization of the curing profile for electronic packaging polymers
Conference Paper
(2005)
Author(s)
F. Huang (External organisation)
Y. Gong (External organisation)
Q Li (External organisation)
D Yang (TU Delft - Dynamics of Micro and Nano Systems)
Research Group
Dynamics of Micro and Nano Systems
To reference this document use:
https://resolver.tudelft.nl/uuid:671ef858-a772-40f1-8343-4b452b368c61
More Info
expand_more
expand_more
Publication Year
2005
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
221-225
ISBN (print)
0-7803-9449-6
No files available
Metadata only record. There are no files for this record.