Powerful polymeric thermal microactuator with embedded silicon microstructure

Journal article (2007)

Authors

GK Lau Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
J.F.L. Goosen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
A. van Keulen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
T Chu Duc Electronic Components, Technology and Materials - EEMCS
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2007

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

A powerful and effective design of a polymeric thermal microactuator is presented. The design has SU-8 epoxy layers filled and bonded in a meandering silicon (Si) microstructure. The silicon microstructure reinforces the SU-8 layers by lateral restraint. It also improves the transverse thermal expansion coefficient and heat transfer for the bonded SU-8 layers. A theoretical model shows that the proposed SU-8/Si composite can deliver an actuation stress of 1.30 MPa/K, which is approximately 2.7 times higher than the unconstrained SU-8 layer, while delivering an approximately equal thermal strain.