Modeling and characterization of molding compound properties during cure

Journal article (2009)

Authors

K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
C. Qian Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
C Bohm External organisation
A Kessler External organisation
H Preu External organisation
M Stecher External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die.