Modeling and characterization of molding compound properties during cure
Kaspar M.B. Jansen (TU Delft - Computational Design and Mechanics)
C Qian (TU Delft - Computational Design and Mechanics)
Leo Ernst (TU Delft - Computational Design and Mechanics)
C Bohm (External organisation)
A Kessler (External organisation)
H. Preu (External organisation)
M Stecher (External organisation)
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Abstract
During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die.
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