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Surface integrated field equations method to solve 3D electromagnetic problems

Conference Paper (2010)
Author(s)

Z Sheng (TU Delft - Electrical Engineering, Mathematics and Computer Science)

PM Dewilde (TU Delft - Electrical Engineering, Mathematics and Computer Science)

RF Remis (TU Delft - Electromagnetism)

Research Group
Signal Processing Systems
DOI related publication
https://doi.org/10.1007/978-3-642-12294-1_11 Final published version
More Info
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Publication Year
2010
Language
English
Research Group
Signal Processing Systems
Pages (from-to)
77-84
Publisher
Springer
ISBN (print)
978-3-642-12293-4
ISBN (electronic)
978-3-642-12294-1
Event
Seventh International Conference on Scientific Computing in Electrical Engineering (2008-09-28 - 2008-10-03), Espoo, Finland
Downloads counter
125

Abstract

This paper describes how the Surface Integrated Field Equations method (SIFE) is implemented to solve 3D Electromagnetic (EM) problems on substrates in which high contrast materials occur. It gives an account of the promising results that are obtained with it when compared to traditional approaches. Advantages of the method are the highly improved flexibility and accuracy for a given discretization level, at the cost of higher computational complexity.