RF-MEMS wafer-level packaging using through-wafer interconnect
Conference Paper
(2006)
Author(s)
J. Tian (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
J Iannacci (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
R Gaddi (External organisation)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:80188d9e-8112-4833-bc5c-981d6a399307
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Publication Year
2006
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
T2CP7/1-T2CP7/4
ISBN (print)
91-631-9281-0
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