A photonic MEMS interposer to solve electronic and optical assembly challenges
Jian Li (TU Delft - Electronic Components, Technology and Materials)
Andrzej Sielecki (Philips)
Elena Beletkaia (Philips)
More Info
expand_more
Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.
Abstract
Photonic applications often face industry-specific assembly requirements that can be challenging to overcome. There is a need for micron-accurate alignment, device miniaturization and integration in challenging form factors. Special materials and packaging must be developed for the best performance of the devices in exacting environmental conditions. In the medical field, these requirements are additionally complicated by the demanding ISO 13485 regulations. The article demonstrates how solutions are found in a combination of new and existing technology in microelectronics packaging and now made suitable for photonics.
help_outline