Photonic Motherboard
A Scalable Approach for Building Complex Photonic Systems
Letícia S. Magalhães (Harvard School of Engineering and Applied Sciences)
Donald Witt (Harvard School of Engineering and Applied Sciences)
Amirhassan Shams-Ansari (Harvard School of Engineering and Applied Sciences, DRS Daylight Solutions Inc.)
Shima Rajabali (TU Delft - Quantum Circuit Architectures and Technology, Harvard School of Engineering and Applied Sciences, TU Delft - Quantum & Computer Engineering)
Daniel Assumpcao (Harvard School of Engineering and Applied Sciences)
Xinrui Zhu (Harvard School of Engineering and Applied Sciences)
Hana K. Warner (Harvard School of Engineering and Applied Sciences)
Matthew Yeh (Harvard School of Engineering and Applied Sciences)
Yaowen Hu (Harvard School of Engineering and Applied Sciences, Peking University)
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Abstract
We present a photonic integration method combining flip-chip bonding and photonic wirebonding. This approach enables a 'mother' substrate to host 'child' chips from diverse platforms, fostering seamless integration for multi-functional photonic architectures.
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File under embargo until 20-04-2026