Photonic Motherboard

A Scalable Approach for Building Complex Photonic Systems

Conference Paper (2025)
Author(s)

Letícia S. Magalhães (Harvard School of Engineering and Applied Sciences)

Donald Witt (Harvard School of Engineering and Applied Sciences)

Amirhassan Shams-Ansari (Harvard School of Engineering and Applied Sciences, DRS Daylight Solutions Inc.)

Shima Rajabali (TU Delft - Quantum Circuit Architectures and Technology, Harvard School of Engineering and Applied Sciences, TU Delft - Quantum & Computer Engineering)

Daniel Assumpcao (Harvard School of Engineering and Applied Sciences)

Xinrui Zhu (Harvard School of Engineering and Applied Sciences)

Hana K. Warner (Harvard School of Engineering and Applied Sciences)

Matthew Yeh (Harvard School of Engineering and Applied Sciences)

Yaowen Hu (Harvard School of Engineering and Applied Sciences, Peking University)

undefined More Authors (External organisation)

Research Group
Quantum Circuit Architectures and Technology
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Publication Year
2025
Language
English
Research Group
Quantum Circuit Architectures and Technology
Bibliographical Note
Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Article number
AA127-5
Publisher
IEEE
ISBN (electronic)
9781957171500
Event
2025 Conference on Lasers and Electro-Optics, CLEO 2025 (2025-05-04 - 2025-05-09), Long Beach, United States
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Abstract

We present a photonic integration method combining flip-chip bonding and photonic wirebonding. This approach enables a 'mother' substrate to host 'child' chips from diverse platforms, fostering seamless integration for multi-functional photonic architectures.

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