Failure mechanisms along patterned bimaterial interfaces

Journal Article (2026)
Author(s)

Charline van Innis (Vrije Universiteit Brussel, BATir)

Julie Teuwen (TU Delft - Group Teuwen)

Sofia Teixeira de Freitas (TU Delft - Group Teixeira De Freitas, Universidade de Lisbon)

DOI related publication
https://doi.org/10.1016/j.tafmec.2026.105586 Final published version
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Publication Year
2026
Language
English
Journal title
Theoretical and Applied Fracture Mechanics
Volume number
145
Article number
105586
Downloads counter
10
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Abstract

Further development of thermoplastic composites for advanced structural applications, such as in aerospace, requires tough interfaces at bimaterials junctions such as composite-metal interfaces. Mode I failure being the most critical failure mode of interfaces, surface roughening or patterning techniques are commonly used to improve the mode I interface toughness. Patterning typically involves creating grooves on the surface via laser ablation or 3D printing. However, crack propagation may follow two distinct paths: along the groove pattern (interfacial failure) or through the polymer within the grooves (cohesive failure). Cohesive failure is often the toughest mechanism. However, design criteria linking groove geometry to joint materials are currently lacking. This study investigates the influence of groove dimensions, joint dimensions, and material and interface properties on the resulting failure mechanism using a cohesive zone model. First, a small-scale yielding (SSY) model is developed. The results indicate that the characteristic fracture length of the material filling the grooves plays a critical role in determining the failure mechanism. Specifically, cohesive failure is promoted when the groove depth is at least ten times greater than the characteristic length, and when the groove aspect ratio (depth-to-width) exceeds 10. Additionally, filling the grooves with a more compliant material, such as a polymer, helps to prevent interfacial failure. Finally, a double-cantilever model is developed, indicating that the loading configuration significantly influences the failure mechanisms taking place. For the DCB configuration, crack propagation along the interface is promoted, compared to the SSY case, owing to the bending of the adherends.