Investigation of the long-term adhesion and barrier properties of a PDMS-Parylene stack with PECVD ceramic interlayers for the conformal encapsulation of neural implants

Conference paper (2021)

Authors

N. Bakhshaee Babaroud Bio-Electronics - EEMCS
R. Dekker Electronic Components, Technology and Materials - EEMCS , Philips Research
Ole Holk Fraunhofer Institute for Reliability and Microintegration IZM
U. Tiringer Team Arjan Mol - Mechanical, Maritime and Materials Engineering
P. Taheri Team Peyman Taheri - Mechanical, Maritime and Materials Engineering
Domonkos Horvath Institute of Cognitive Neuroscience and Psychology, Research center for Natural Science
Tibor Nanasi Institute of Cognitive Neuroscience and Psychology, Research center for Natural Science
Istvan Ulbert Institute of Cognitive Neuroscience and Psychology, Research center for Natural Science
W.A. Serdijn Bio-Electronics - EEMCS , Erasmus MC
Vasiliki Giagka Fraunhofer Institute for Reliability and Microintegration IZM, Bio-Electronics - EEMCS
Research Group
Bio-Electronics (EEMCS) (TU Delft)
Adhesion PDMS Parylene C Conformal encapsulation Moisture barrier Accelerated soak test
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Published Date

2021

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Bio-Electronics