Simultaneous through-silicon via and large cavity formation using deep reactive ion etching and aluminum etch-stop layer

Tian, J.; Bartek, M.

Simultaneous through-silicon via and large cavity formation using deep reactive ion etching and aluminum etch-stop layer

Conference paper (2008)

Authors

J. Tian Old - EWI Sect. ECTM

M. Bartek Old - EWI Sect. ECTM

Research Group

Old - EWI Sect. ECTM

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Published Date

2008

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Research Group

Old - EWI Sect. ECTM

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