Simultaneous through-silicon via and large cavity formation using deep reactive ion etching and aluminum etch-stop layer

Conference paper (2008)

Authors

J. Tian Old - EWI Sect. ECTM
M. Bartek Old - EWI Sect. ECTM
Research Group
Old - EWI Sect. ECTM
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Published Date

2008

Language

Undefined/Unknown

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Research Group

Old - EWI Sect. ECTM