Simultaneous through-silicon via and large cavity formation using deep reactive ion etching and aluminum etch-stop layer
Conference Paper
(2008)
Research Group
Old - EWI Sect. ECTM
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Publication Year
2008
Research Group
Old - EWI Sect. ECTM
Pages (from-to)
1787-1992
ISBN (print)
978-1-4244-2231-9
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