Effects of Molding Compound Cure on Warpage of Electronic Packages
Conference Paper
(2008)
Author(s)
J de Vreugd (TU Delft - Computational Design and Mechanics)
Kasper Jansen (TU Delft - Computational Design and Mechanics)
LJ Ernst (TU Delft - Computational Design and Mechanics)
C Bohm (External organisation)
A Kessler (External organisation)
H. Preu (External organisation)
Research Group
Computational Design and Mechanics
To reference this document use:
https://resolver.tudelft.nl/uuid:a0ee0832-4fcd-412b-be85-a8c8c51cfb99
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Publication Year
2008
Research Group
Computational Design and Mechanics
Pages (from-to)
675-682
ISBN (print)
978-1-4244-2117-9
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