Characterization of epoxy based highly filled die attach materials in microelectronics

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Characterization of epoxy based highly filled die attach materials in microelectronics

Conference Paper (2017)

Author(s)

I Maus (Infineon Technologies AG)

C. Liebl (Infineon Technologies AG)

M Fink (Infineon Technologies AG)

Duc-Khoi Vu (Infineon Technologies AG)

M. Hartung (Infineon Technologies AG)

H. Preu (Infineon Technologies AG)

Kaspar Jansen (TU Delft - Emerging Materials)

B. Michel (Fraunhofer ENAS)

B Wunderle (Technische Universität Chemnitz, Fraunhofer ENAS)

Laurens Weiss (Infineon Technologies AG)

Research Group

Emerging Materials

DOI related publication

https://doi.org/10.1109/EuroSimE.2017.7926237

Material properties Microassembly Temperature measurement Curing Temperature distribution Heating Systems

To reference this document use:

https://resolver.tudelft.nl/uuid:a2c85dd7-e773-4eb9-ad99-e9dbb75d0ae0

More Info

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Publication Year

2017

Language

English

Research Group

Emerging Materials

Pages (from-to)

1-7

ISBN (print)

978-1-5090-4345-3

ISBN (electronic)

978-1-5090-4344-6

Abstract

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

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