Characterization of epoxy based highly filled die attach materials in microelectronics

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Characterization of epoxy based highly filled die attach materials in microelectronics

Conference Paper (2017)

Author(s)

I. Maus (Infineon Technologies AG)

C. Liebl (Infineon Technologies AG)

M. Fink (Infineon Technologies AG)

Duc-Khoi Vu (Infineon Technologies AG)

M. Hartung (Infineon Technologies AG)

H. Preu (Infineon Technologies AG)

Kaspar Jansen (TU Delft - Materializing Futures)

B. Michel (Fraunhofer ENAS)

B Wunderle (Technische Universität Chemnitz, Fraunhofer ENAS)

Laurens Weiss (Infineon Technologies AG)

Material properties Microassembly Temperature measurement Curing Temperature distribution Heating Systems

DOI related publication

https://doi.org/10.1109/EuroSimE.2017.7926237 Final published version

To reference this document use

https://resolver.tudelft.nl/uuid:a2c85dd7-e773-4eb9-ad99-e9dbb75d0ae0

More Info

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Publication Year

2017

Language

English

Article number

7926237

Pages (from-to)

1-7

ISBN (print)

978-1-5090-4345-3

ISBN (electronic)

978-1-5090-4344-6

Event

Downloads counter

237

Abstract

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.