Characterization of epoxy based highly filled die attach materials in microelectronics

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Characterization of epoxy based highly filled die attach materials in microelectronics

Conference Paper (2017)

Author(s)

I. Maus (Infineon Technologies AG)

C. Liebl (Infineon Technologies AG)

M. Fink (Infineon Technologies AG)

Duc-Khoi Vu (Infineon Technologies AG)

M. Hartung (Infineon Technologies AG)

H. Preu (Infineon Technologies AG)

Kaspar Jansen (TU Delft - Materializing Futures)

B. Michel (Fraunhofer ENAS)

B Wunderle (Technische Universität Chemnitz, Fraunhofer ENAS)

Laurens Weiss (Infineon Technologies AG)

Research Group

Materializing Futures

DOI related publication

https://doi.org/10.1109/EuroSimE.2017.7926237

Material properties Microassembly Temperature measurement Curing Temperature distribution Heating Systems

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https://resolver.tudelft.nl/uuid:a2c85dd7-e773-4eb9-ad99-e9dbb75d0ae0

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Publication Year

2017

Language

English

Research Group

Materializing Futures

Article number

7926237

Pages (from-to)

1-7

ISBN (print)

978-1-5090-4345-3

ISBN (electronic)

978-1-5090-4344-6

Event

18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 (2017-04-03 - 2017-04-05), Dresden, Germany

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Abstract

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

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