Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

Conference paper (2014)

Authors

A.R. Rezaie Adli OLD Product Engineering
K.M.B. Jansen OLD Product Engineering
F Schindler-Saefkow External organisation
F Rost External organisation
Research Group
OLD Product Engineering
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Published Date

2014

Language

English

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Research Group

OLD Product Engineering