On lead-free soldering of QFP, BGA components on PCBs with different finishes for industrial applications

Conference paper (2005)

Authors

M Biglari Materials Science and Engineering
G Gerrits External organisation
M Helvoort External organisation
W.G. Sloof OLD Surface and Interface Engineering
E.R. Peekstok OLD Metals Processing, Microstructures and Properties
MH Biglari External organisation
Department
Materials Science and Engineering
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Published Date

2005

Language

Undefined/Unknown

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Department

Materials Science and Engineering