On lead-free soldering of QFP, BGA components on PCBs with different finishes for industrial applications
Conference Paper
(2005)
Author(s)
M Biglari (TU Delft - Materials Science and Engineering)
G Gerrits (External organisation)
M Helvoort (External organisation)
W.G. Sloof (TU Delft - OLD Surface and Interface Engineering)
ER Peekstok (TU Delft - OLD Metals Processing, Microstructures and Properties)
MH Biglari (External organisation)
Department
Materials Science and Engineering
To reference this document use:
https://resolver.tudelft.nl/uuid:a56ce97b-e2e9-4ed3-a462-dabd04026fd6
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Publication Year
2005
Department
Materials Science and Engineering
Pages (from-to)
1-9
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