A new integrated packaging technology for high-power automative electronics
Journal Article
(2004)
Author(s)
IW Hofsajer (External organisation)
MB Gerber (TU Delft - Electrical Power Processing)
JA Ferreira (TU Delft - Electrical Power Processing)
N Seliger (External organisation)
Research Group
Electrical Power Processing
To reference this document use:
https://resolver.tudelft.nl/uuid:b1710966-37ba-421c-b5ba-f270414d3e96
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Publication Year
2004
Research Group
Electrical Power Processing
Issue number
5/6
Volume number
100
Pages (from-to)
273-278
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