RF-MEMS wafer-level packaging using through-wafer via technology
Conference Paper
(2006)
Author(s)
J. Tian (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
J Iannacci (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
S Sosin (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
R Gaddi (External organisation)
M. Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:b9b260da-bce3-4b78-b575-11b974c90407
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Publication Year
2006
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
441-447
ISBN (print)
1-4244-0664-1
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