RF-MEMS wafer-level packaging using through-wafer via technology

Tian, J.; Iannacci, J; Sosin, S; Gaddi, R; Bartek, M.

RF-MEMS wafer-level packaging using through-wafer via technology

Conference paper (2006)

Authors

J. Tian Old - EWI Ch. Integrated Sensing Devices

J Iannacci Old - EWI Ch. Integrated Sensing Devices

S Sosin Old - EWI Ch. Integrated Sensing Devices

R Gaddi External organisation

M. Bartek Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2006

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Research Group

Old - EWI Ch. Integrated Sensing Devices

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