Study of thermal and thermo-mechanical behavior in a multi-chip-composed optoelectronic package
Conference Paper
(2007)
Author(s)
J. Tian (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
M. Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
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https://resolver.tudelft.nl/uuid:bc4d670a-7a97-4bda-8d28-1f938560c607
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Publication Year
2007
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
886-891
ISBN (print)
1-4244-1323-0
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