Study of thermal and thermo-mechanical behavior in a multi-chip-composed optoelectronic package

Tian, J.; Bartek, M.

Study of thermal and thermo-mechanical behavior in a multi-chip-composed optoelectronic package

Conference paper (2007)

Authors

J. Tian Old - EWI Ch. Integrated Sensing Devices

M. Bartek Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2007

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Research Group

Old - EWI Ch. Integrated Sensing Devices

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