Hybrid wafer-level packaging for RF MEMS applications
Conference Paper
(2006)
Author(s)
J Iannacci (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
J Tian (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
S Sosin (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
A.B. Akhnoukh (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
R Gaddi (External organisation)
A Gnudi (External organisation)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:d752bf0b-4c67-4675-963f-23bb5123caa7
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Publication Year
2006
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
106-113
ISBN (print)
0-9789465-2-9
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