Moisture Effects on the Creep of Thermosetting IC Packaging Polymers
Conference Paper
(2006)
Author(s)
X. Ma (TU Delft - Computational Design and Mechanics)
Kaspar Jansen (TU Delft - Computational Design and Mechanics)
LJ Ernst (TU Delft - Computational Design and Mechanics)
Research Group
Computational Design and Mechanics
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https://resolver.tudelft.nl/uuid:dc67f925-2fbf-49ed-9bf0-d1e6350e4a69
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Publication Year
2006
Research Group
Computational Design and Mechanics
Pages (from-to)
1-5
ISBN (print)
1-4244-0276X
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