Moisture Effects on the Creep of Thermosetting IC Packaging Polymers

Ma, X.; Jansen, Kasper; Ernst, LJ

Moisture Effects on the Creep of Thermosetting IC Packaging Polymers

Conference paper (2006)

Authors

X. Ma Computational Design and Mechanics

Kasper Jansen Computational Design and Mechanics

LJ Ernst Computational Design and Mechanics

Research Group

Computational Design and Mechanics

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Published Date

2006

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Research Group

Computational Design and Mechanics

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