Hybrid wafer-level packaging based on a capping substrate with cavities
Conference Paper
(2006)
Author(s)
S Sosin (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
J Tian (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:ef37f218-eac8-4878-bdcb-43517125063d
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Publication Year
2006
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
M3CP6/1-M3CP6/4
ISBN (print)
91-631-9281-0
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