Hybrid wafer-level packaging based on a capping substrate with cavities

Sosin, S; Tian, J.; Bartek, M.

Hybrid wafer-level packaging based on a capping substrate with cavities

Conference paper (2006)

Authors

S Sosin Old - EWI Ch. Integrated Sensing Devices

J. Tian Old - EWI Ch. Integrated Sensing Devices

M. Bartek Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

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Published Date

2006

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Research Group

Old - EWI Ch. Integrated Sensing Devices

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